| 1+ | 10+ | 100+ | 1000+ | 10000+ | Custom | |
|---|---|---|---|---|---|---|
| Uni Price | $285.168 | Get Quotation! | Get Quotation! | Get Quotation! | Get Quotation! | Get Quotation! |
| Contact Finish - Mating | Gold |
|---|---|
| Operating Temperature | - |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
| Termination | Solder |
| Mounting Type | Through Hole |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 44 (2 x 22) |
| Pitch - Post | 0.050" (1.27mm) |
| Contact Finish Thickness - Post | 20.0µin (0.51µm) |
| Series | 547 |
| Type | SOIC, ZIF (ZIP) |
| Contact Finish - Post | Gold |
| Pitch - Mating | - |
| Contact Material - Mating | Beryllium Copper |
| Features | Closed Frame |
| Package | Bulk |
Room 305A, ShangHang Building, NO.23 Building , ShangBu Industrial Zone, Hongli Road, Futian, Shenzhen China, 518028! Contact Us Now!