1+ | 10+ | 100+ | 1000+ | 10000+ | Custom | |
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Min Operating Temperature | -40°C |
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Surface Mount | YES |
Terminal Finish | Tin/Lead (Sn/Pb) |
Radiation Hardening | No |
Terminal Position | BOTTOM |
Package / Case | FBGA |
Technology | CMOS |
Core Architecture | ARM |
Terminal Form | BALL |
Number of Pins | 256 |
Number of Terminations | 256 |
Supply Voltage | 1.5V |
Lead Free | Contains Lead |
RoHS Status | RoHS Compliant |
Moisture Sensitivity Level (MSL) | 3 |
RAM Size | 64kB |
Number of Logic Blocks (LABs) | 24 |
Number of I/O | 117 |
Peripherals | DMA, POR, WDT |
JESD-609 Code | e0 |
Number of Outputs | 66 |
Time@Peak Reflow Temperature-Max (s) | 20 |
Max Operating Temperature | 100°C |
Peak Reflow Temperature (Cel) | 225 |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Subcategory | Field Programmable Gate Arrays |
Operating Supply Voltage | 1.5V |
Frequency (Max) | 120MHz |
Part Status | Active |
Number of Gates | 500000 |
Frequency | 100MHz |
Published | 2015 |
Speed Grade | 1 |
Number of Registers | 11520 |
Interface | EBI/EMI, Ethernet, I2C, SPI, UART, USART |
Temperature Grade | INDUSTRIAL |
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