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IC-316-SGG
the part number is IC-316-SGG
Part
IC-316-SGG
Manufacturer
Description
CONN IC DIP SOCKET 16POS GOLD
Lead Free/ROHS
pb RoHs
Datasheets
CAD Models
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Specification
Contact Finish - Mating Gold
Operating Temperature -55°C ~ 125°C
Contact Material - Post Phosphor Bronze
Housing Material Polyester, Glass Filled
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Termination Solder
Mounting Type Through Hole
Product Status Obsolete
Number of Positions or Pins (Grid) 16 (2 x 8)
Pitch - Post 0.100" (2.54mm)
Contact Finish Thickness - Post 30.0µin (0.76µm)
Series IC
Type DIP, 0.3" (7.62mm) Row Spacing
Contact Finish - Post Gold
Pitch - Mating 0.100" (2.54mm)
Contact Material - Mating Beryllium Copper
Features Open Frame
Package Bulk
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