| 1+ | 10+ | 100+ | 1000+ | 10000+ | Custom | |
|---|---|---|---|---|---|---|
| Uni Price | Get Quotation! | Get Quotation! | Get Quotation! | Get Quotation! | Get Quotation! | Get Quotation! |
| Thermal Conductivity: | 0.8 W/m-K |
|---|---|
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Detailed Description: | Thermal Pad Gray 36.83mm x 21.29mm Rectangular Adhesive - One Side |
| Adhesive: | Adhesive - One Side |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 2 Weeks |
| Shape: | Rectangular |
| Thermal Resistivity: | 0.35°C/W |
| Email: | [email protected] |
| Outline: | 36.83mm x 21.29mm |
| Color: | Gray |
| Series: | Hi-Flow® 115-AC |
| Usage: | SIP |
| Type: | Pad, Sheet |
| Thickness: | 0.0055" (0.140mm) |
| Other Names: | BER170 HF115AC-105 HF115AC00055AC105 HF115TAAC-105 |
| Material: | Phase Change Compound |
| Backing, Carrier: | Fiberglass |
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