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HF115AC-0.0055-AC-58
the part number is HF115AC-0.0055-AC-58
Part
HF115AC-0.0055-AC-58
Manufacturer
Description
THERM PAD 19.05MMX12.7MM W/ADH
Lead Free/ROHS
pb RoHs
Datasheets
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Specification
Thermal Conductivity: 0.8 W/m-K
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Detailed Description: Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Adhesive: Adhesive - One Side
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Manufacturer Standard Lead Time: 2 Weeks
Shape: Rectangular
Thermal Resistivity: 0.35°C/W
Email: [email protected]
Outline: 19.05mm x 12.70mm
Color: Gray
Series: Hi-Flow® 115-AC
Usage: TO-220
Type: Pad, Sheet
Thickness: 0.0055" (0.140mm)
Other Names: BER168 BG426642 HF115AC-58 HF115AC00055AC58 HF115TAAC-58
Material: Phase Change Compound
Backing, Carrier: Fiberglass
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